Flexible Circuit Technologies

Air Gap – Through the process of selective bonding, increased flexibility is achieved by "unbonding" layers so they are allowed to flex freely.  At Flexible Circuit, we are proud to be a leading designer of this air gap technology allowing your designs more flexibility.

Component Assembly – At Flexible Circuit, we offer through hole and surface mount capabilities, as well as in circuit testing, conformal coating and electrostatic protective packaging.

Controlled Impedance - With increasing signal switching speeds, engineers need to understand and control the impedance of traces. With short signal transition times and high clock rates of modern digital circuitry, traces need to be considered transmission lines instead of simple interconnections. With today's higher speed requirements, controlled impedance traces are designed to minimize electrical reflections and ensure an error free transition between the track and interconnections.

Controlled impedance, if perfectly optimized, allows control of the physical dimensions and material of the cable. Controlled impedance signal transmission requires flexible circuit materials to be uniform in both thickness and electrical properties. It is necessary that the circuit manufacturer accurately etch the copper foil to optimize impedance.

Panelization – Multiple circuits are partially die-cut with break-out tabs to allow them to remain in the panel for component assembly during the "pick & place" and wave soldering processes. Once the panel of rigid flex circuit boards is assembled, simply clip them out by cutting the breakout tabs and they are ready for assembly into your final product.

Pressure Sensitive Adhesives (PSAs) – PSAs with a release liner are used in applications where a portion(s) of the circuit needs to be secured to a specific location within the final product. During assembly, the release liner is peeled away and the exposed adhesive allows the assembler to press the circuit into place and keep it there.

Shielding – Shielding is applied when an application requires limits in electromagnetic and/or electrostatic interference. Protective shielding can be patterned or solid. Either way, it reduces noise and controls impedance of signal lines. Repeatability is ensured through etching.